12a1 Wafer Hub Dicing yabonye Blade Diamond Dicing Blade ya SCOde ya Wafer

12a1 Wafer Hub Dicing yabonye Blade Diamond Dicing Blade ya Scrict ya Wafer Yerekanwe Ishusho

Ibisobanuro bigufi:

Diamond Diking Blade ikoreshwa mugukubita, guca Silicon Wafer, ibigo byihuta byihuta, ibirahure nibindi bikoresho muburyo bwa elegitoroniki. Dicing Traildes yacu irimo Diamond Hub Dicing Blade na Diamond hunkulss dicong clade. Ihuriro ririmo ibishishwa bisinze dicing clade, ibyuma bitandukanya icyuma na Nickel ivanze blade.ibintu byatoranijwe.

Ohereza imeri kuri twe

Ibisobanuro birambuye

Ibicuruzwa

Porogaramu: Kwandika Dicing Ic Wafers, Gallium Arsenide, Gallium Phosinide, Ubuyobozi bwa Epoxy, Ububiko bwa Epoxy
Nigute Guhitamo Ubwoko bukwiye bwa Wafer Blade Gukata Ibikoresho?
* Binder ya resin Bond (imbaraga zoroshye) zivanze icyuma, zandika ibikoresho bikomeye kandi byubatswe
* Binder yicyuma (imbaraga ziciriritse) dicing clade
* Binder ya velat ya electchplated (ubumwe bukomeye), yandika ibikoresho byoroheje

Ibyiza bya Wafer Hub Dicing Yabonye Blades
Gukata neza cyane - Gukora uburyo busukuye kandi bwuzuye hamwe na chimime nkeya.
Ikirenga Ikiruta Gukomera - Kugabanya uruzitiro rwo gutera imbere gukata.
Igishushanyo cya Kerf Igishushanyo - kigabanya igihombo cyibintu no kuzamura umusaruro.
Yagutse ubuzima bwumuriro - yanogamiye kuramba kandi bihamye.
Ibisobanuro byihariye - biboneka muburyo butandukanye, diamest, na grit kugirango bahuze porogaramu yihariye.