Vitrient Bond Diamond Ikiziga gisya uruziga rwo gusya muri silicon wafer

Ibisobanuro bigufi:

Intoki zo gusya zikoreshwa cyane cyane mugukuramo no gusya neza wa silicon wafer. Ibicuruzwa byakozwe nikigo cyacu gifite imikorere isumba izindi nigiciro kinini.
Imikorere iri murwego rwo hejuru kwisi yose. Barashobora gukoreshwa hamwe nabayapani, Ikidage, Abanyamerika, Abanyakereya n'Abashinwa.


Ibisobanuro birambuye

Ibicuruzwa

Vitdied Bond Gusya Uruziga
Uru ruhererekane rwibiziga bya diyama byakoreshejwe cyane mugusubiza inyuma no gutunganya ibisanzwe bya semiconductor. Ibikoresho byihariye, ibikoresho byinjijwemo, hamwe na baffer ya silicon.
Resin bond inyuma yo gusya uruziga
Resin Bond Surd Gusya ibiziga bikozwe muri Thermoses Resin na Diamond, bikoreshwa kuri Wafers wa Silicon, Saficore, Gallium Nitsenide, Gallium arsenide.

Icyitegererezo
D (mm)
T (MM)
H (mm)
6a2 / 6a2h
175
30, 35
76
200
35
76
350
45
127
6a2T
195
22.5, 25
170
280
30
228.6
6a2T (ellips eshatu)
350
35
235
209
22.5
158
Ibindi bisobanuro birashobora gukorwa ukurikije ibyifuzo byabakiriya.

Ibyiza byo gusya uruziga
1. Hamwe no kwangirika no hejuru
2.Ntabwo buryo bukurikirana bushoboka bushoboka nubukari buhebuje
3. Ifasha kugabanya ibyangiritse, kunoza imikorere yo gutunganya no kugabanya ibiciro byo gutunganya, kandi ni ibyahinduwe ukurikije abakiriya bakeneye

IMG_5873
IMG_5888

1.gusaba gusya uruziga:
Inyuma yoroheje, gusya imbere no gusya ibikoresho byiza byangiza, abazunguruko bahujwe na Silicore, wafer wa SELICHIF, muri Silicon
2. Ibikorwa byakorewe: Silicon Wafer y'ibikoresho bibisi, chip ihuriweho (IC) n'isugi n'ibindi.
3. Ibikoresho byakorewe: Monocrystalline Silicon, Gallium Arsenide, Indimi ya Indium, Silicon Carbide nandi bikoresho bya SemicoNuctor.
4. Porogaramu: Inyuma yoroheje, gusya no gusya neza
5. Shira imashini yo gusya: Inziga zo gusya inyuma zirashobora gukoreshwa mu kiyapani, Ikidage, Abanyamerika, Abanyamerika, Shuwa, Okomoto, Disco, Imashini yo gusya, nibindi).

Inyuma yo gusya ibiziga (3)

  • Mbere:
  • Ibikurikira: